| 近年来代表性论文 Zhang Yu, Kang Renke, et al. Mechanical effect of abrasives on silicon surface in chemo-mechanical grinding [J]. International Journal of Mechanical Sciences, 2023. Zhang Yu, Kang Renke, et al. A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters[J]. Precision Engineering, 2021. Kang Renke,Zhang Yu, et al. High surface integrity fabrication of silicon wafers using a newly developed nonwoven structured grind-polishing wheel, Journal of manufacturing processes, 2022 张瑜，康仁科，等.湿式机械化学磨削单晶硅的软磨料砂轮及其磨削性能[J].机械工程学报, 2022. Zhang Yu, Gao Shang, et al. Grinding Performance of Diamond Grinding Tools for Sapphire Crystal[J]. Advanced Materials Research, 2014. Gao Shang, Li Honggang, Kang Renke,Zhang Yu, et al. Effect of strain rate on the deformation characteristic of AlN ceramics under scratching[J]. Micromachines, 2021. Wang Ziguang, Yan feng,Zhang Yu, et al. The material deformation modes of monocrystalline gallium antimonide (GaSb) under nano-scratching[J]. Frontiers in materials, 2023. Gao Shang, Huang Jinxing,Zhang Yu, et al. The grinding performance of a newly developed soft abrasive grinding wheel for silicon wafers during wet grinding process. The 23rd International Symposium on Advances in Abrasive Technology, Hokkaido, 2021, Japan. Wu Zihe, Cheng Jirui,Zhang Yu, et al. Modeling on the flatness of silicon wafers ground by the grind-polishing wheel [C]. 10th International Conference on Advanced Manufacturing Technology Materials Engineering, 2023, Zhu Hai, China.
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