张乃方 讲师 学位:工学博士 职称:讲师 毕业院校:上海交通大学 办公地点:西四楼301 联系方式:zhangnaif@163.com/15221188612 |
个人简介
主要从事金属凝固过程原位表征研究,涉及异质材料液/固界面反应动力学、凝固组织的形成与控制等。至今已在Journal of Materials Science &Technology, Metallurgical and Materials Transactions A等国内外期刊上发表多篇学术论文。 |
研究方向
异质材料连接界面原位表征 Al合金凝固过程调控 |
教育背景
2017.09-2023.12,上海交通大学,材料科学与工程,博士 2013.09-2016.07,河南科技大学,材料学,硕士 2009.09-2013.07,河南科技大学,金属材料工程,学士 |
论文专著与专利
代表性论文: [1] Zhang N F, Lu W Q, Ding Z Y, Hu Q D, Li J G, et al. Effect of Si on the Growth Behavior of the Fe2Al5 Phase at Al-xSi (liquid)/Fe (solid) Interface During Holding by In-Situ Synchrotron Radiography[J]. Metallurgical and Materials Transactions A, 2020, 51(6): 2711-2718. [2] Zhang N F, Lu W Q, Ding Z Y, Hu Q D, Li J G, et al. 3D morphological evolution and growth mechanism of proeutectic FeAl3 phases formed at Al/Fe interface under different cooling rates[J]. Journal of Materials Science &Technology, 2022, 116: 83-93. [3] Zhang N F, Lu W Q, Ding Z Y, Hu Q D, Li J G, et al. 3D morphology and growth mechanism of primary Al3Ni in directionallysolidified Al-16 wt% Ni alloy[J]. Journal of Alloys and Compounds,2023,938(25): 168659. [4] Lu W Q1, Zhang N F1, Ding Z Y, Hu Q D, Li J G, et al. Recent progress on apparatus development and in situ observation of metal solidification processes by synchrotron radiation X-ray imaging: A review[J]. Transactions of Nonferrous Metals Society of China. [5] Lu W Q, Zhang N F, Ding Z Y, Hu Q D, Li J G, et al. Bubble growth, intermetallic compounds dissolution and their interactions during heating of an Al-5wt.% Mn alloy by in-situ synchrotron radiography[J]. Journal of Alloys and Compounds, 2020, 822: 153554. [6] Lu W Q, Zhang N F, Ding Z Y, Hu Q D, Li J G, et al. Bubble-induced formation of new intermetallic compounds in an Al–Mn alloy during heating observed by synchrotron radiography[J]. Materialia, 2021, 15: 100991 [7] Ding Z Y, Zhang N F, Hu Q D, Li J G, et al. Recent Progress in Metallurgical Bonding Mechanisms at the Liquid/Solid Interface of Dissimilar Metals Investigated via in situ X-ray Imaging Technologies[J]. Acta Metallurgica Sinica (English Letters), 2021: 1-24. |